Light emitting diode display with redundancy scheme

ABSTRACT

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

RELATED APPLICATIONS

This application is a continuation of co-pending U.S. patent applicationSer. No. 16/529,670, filed Aug. 1, 2019 which is a continuation of U.S.patent application Ser. No. 15/828,069, filed Nov. 30, 2017, now U.S.Pat. No. 10,411,210, which is a continuation of U.S. patent applicationSer. No. 14/798,298, filed on Jul. 13, 2015, now U.S. Pat. No.9,865,832, which is a continuation of U.S. patent application Ser. No.13/842,925, filed on Mar. 15, 2013, now U.S. Pat. No. 9,252,375, whichis related to U.S. patent application Ser. No. 13/842,879, filed Mar.15, 2013, now U.S. Pat. No. 8,791,474. The full disclosure of U.S.patent application Ser. No. 13/842,925 is incorporated herein byreference.

BACKGROUND Field

Embodiments of the present invention relate to display systems. Moreparticularly embodiments of the present invention relate to displaysystems incorporating micro light emitting diodes.

Background Information

Flat panel displays are gaining popularity in a wide range of electronicdevices. Common types of flat panel displays include active matrixdisplays and passive matrix displays. Each pixel in an active matrixdisplay panel is driven by active driving circuitry, while each pixel ina passive matrix display panel does not use such driving circuitry.High-resolution color display panels, such as modern computer displays,smart phones and televisions typically use an active matrix displaypanel structure for better image quality.

One kind of display panel that is finding commercial application is anactive matrix organic light emitting diode (AMOLED) display panel. FIG.1 is a top view illustration of a top emission AMOLED display panel.FIG. 2 is a cross-sectional side view illustration of FIG. 1 taken alongline X-X in the pixel area 104 and line Y-Y crossing the ground ring 116in the non-pixel area which is any area on the substrate 102 not withinthe pixel area 104. The AMOLED display panel 100 illustrated in FIGS.1-2 generally includes a thin film transistor (TFT) substrate 102supporting a pixel area 104 and non-pixel area outside of the pixel area104. A TFT substrate 102 is also referred to as a backplane. A TFTsubstrate which has been further processed to additionally include thepixel area and non-pixel area is also often referred to as a backplane.Two primary TFT substrate technologies used in AMOLEDs includepolycrystalline silicon (poly-Si) and amorphous silicon (a-Si). Thesetechnologies offer the potential for fabricating the active matrixbackplanes at low temperatures (below 200° C.) directly onto flexibleplastic substrates for producing flexible AMOLED displays. The pixelarea 104 generally includes pixels 106 and subpixels 108 arranged in amatrix, and a set of TFTs and capacitors connected to each subpixel fordriving and switching the subpixels. The non-pixel area generallyincludes a data driver circuit 110 connected to a data line of eachsubpixel to enable data signals (Vdata) to be transmitted to thesubpixels, a scan driver circuit 112 connected to scan lines of thesubpixels to enable scan signals (Vscan) to be transmitted to thesubpixels, a power supply line 114 to transmit a power signal (Vdd) tothe TFTs, and a ground ring 116 to transmit a ground signal (Vss) to thearray of subpixels. As shown, the data driver circuit, scan drivercircuit, power supply line, and ground ring are all connected to aflexible circuit board (FCB) 113 which includes a power source forsupplying power to the power supply line 114 and a power source groundline electrically connected to the ground ring 116.

In the exemplary AMOLED backplane configuration an organic thin film 120and top electrode 118 are deposited over every subpixel 108 in the pixelarea 104. The organic thin film 120 may include multiple layers such asa hole injection layer, hole transport layer, light emitting layer,electron transport layer, and electron injection layer. The multiplelayers of the organic thin film 120 are typically formed over the entirepixel area 104, however, the light emitting layer is often depositedwith aid of a shadow mask only within the subpixel openings 127 and onthe bottom electrode layer 124 corresponding to the emission area forthe array of subpixels 108. A top electrode layer 118 is then depositedover the organic thin film within both the pixel area 104 and alsowithin the non-pixel area so that the top electrode 118 layer overlapsthe ground ring 116 in the in order to transfer the ground signal to thearray of subpixels. In this manner, each of the subpixels 108 can beindividually addressed with the corresponding underlying TFT circuitrywhile a uniform ground signal is supplied to the top of the pixel area104.

In the particular implementation illustrated, the TFT substrate 102includes a switching transistor T1 connected to a data line 111 from thedata driver circuit 110 and a driving transistor T2 connected to a powerline 115 connected to the power supply line 114. The gate of theswitching transistor T1 may also be connected to a scan line (notillustrated) from the scan driver circuit 112. A planarization layer 122is formed over the TFT substrate, and openings are formed to expose theTFT working circuitry. As illustrated, a bottom electrode layer 124 isformed on the planarization layer in electrical connection with the TFTcircuitry. Following the formation of the electrode layer a pixeldefining layer 125 is formed including an array of subpixel openings 127corresponding to the emission area for the array of subpixels 108,followed by deposition of the organic layer 120 and top electrode layer118 over the patterned pixel defining layer, and within subpixelopenings 127 of the patterned pixel defining layer 125. The topelectrode layer 118 additionally is formed in the non-pixel area and inelectrical connection with the ground ring 116.

The planarization layer 122 may function to prevent (or protect) theorganic layer 120 and the bottom electrode layer 124 from shorting dueto a step difference. Exemplary planarization layer 122 materialsinclude benzocyclobutene (BCB) and acrylic. The pixel defining layer 125can be formed of a material such as polyimide. The bottom electrode 124is commonly formed on indium tin oxide (ITO), ITO/Ag, ITO/Ag/ITO,ITO/Ag/indium zinc oxide (IZO), or ITO/Ag alloy/ITO. The top electrodelayer 118 is formed of a transparent material such as ITO for topemission.

While AMOLED display panels generally consume less power than liquidcrystal display (LCD) panels, an AMOLED display panel can still be thedominant power consumer in battery-operated devices. To extend batterylife, it is necessary to reduce the power consumption of the displaypanel.

SUMMARY OF THE INVENTION

A display panel with redundancy scheme and method of manufacture aredescribed. In an embodiment, a display panel includes a displaysubstrate with a pixel area and a non-pixel area. The pixel areaincludes an array of subpixels and a corresponding array of bottomelectrodes within the array of subpixels. An array of micro LED devicespairs are bonded to the array of bottom electrodes, and one or more topelectrodes are formed in electrical contact with the array of micro LEDdevice pairs. The micro LED devices may be formed of a semiconductormaterial, and may have a maximum width of 1 to 100 μm.

In one application, the display substrate can be a TFT substrate. Aground line may be formed in the non-pixel area of the TFT substrate,and the one or more of the top electrode layers are electricallyconnected to the ground line. In one embodiment, a first to electrodelayer electrically connects a first micro LED device of a micro LEDdevice pair to the ground line, and a separate second top electrodelayer electrically connects a second micro LED device of the micro LEDdevice pair to the ground line.

In one application, an array of micro controller chips are bonded to thedisplay substrate, with each bottom electrode electrically connected toa micro controller chip. Each micro controller chip can be connected toa scan driver circuit and a data driver circuit. A ground line may runin the non-pixel area of the display substrate, and the one or more ofthe top electrode layers are electrically connected to the ground line.In one embodiment, a first top electrode layer electrically connects afirst micro LED device of a micro LED device pair to the ground line,and a separate second top electrode layer electrically connects a secondmicro LED device of the micro LED device pair to the ground line.

In an embedment, a plurality of micro LED device irregularities arewithin the array of micro LED device pairs. For example, theirregularities can be missing micro LED devices, defective micro LEDdevices, and contaminated micro LED devices. A passivation layermaterial can be used to cover the plurality of irregularities, and toelectrically insulate the plurality of irregularities. The passivationlayer material may also be used to cover sidewalls (e.g. including aquantum well structure) of the array of micro LED device pairs. In oneembodiment the one or more top electrode layers do not make electricalcontact with the plurality of irregularities, even where the one or moretope electrode layers are formed directly over the plurality ofirregularities. The one or more top electrode layers may also be formedelsewhere, or formed around the plurality of irregularities so that theyare not formed directly over the plurality of irregularities. In anembodiment, a repair micro LED device is bonded to one of the bottomelectrodes including one of the micro LED device irregularities.

In an embodiment, a method of forming a display panel includes anintegrated test to detect irregularities in the array of micro LEDdevices. An array of micro LED devices can be electrostaticallytransferred from one or more carrier substrates to a corresponding arrayof bottom electrodes within a corresponding array of subpixels on adisplay substrate. The surface of the display substrate is then imagedto detect irregularities in the array of micro LED devices, and apassivation layer material is then formed over a plurality of detectedirregularities to electrically insulate the plurality of irregularities.One or more top electrode layers can then be formed in electricalcontact with the array of micro LED devices without making electricalcontact with the plurality of irregularities. In some embodiment, thepassivation layer material is formed over the plurality ofirregularities by ink jet printing or screen printing, and the one ormore top electrode layers are formed by ink jet printing or screenprinting. In an embodiment, the one or more top electrode layers areseparate top electrode layers. In another embodiment, one of theseparate top electrode layers is scribed to cut off an electrical pathto a ground line.

Imaging the surface of the display substrate may be performed with acamera. In an embodiment, an image produced from the camera is used todetect irregularities such as missing micro LED devices or contaminatedmicro LED devices. In an embodiment, imaging includes illuminating thesurface of the display substrate with a light source to cause the arrayof micro LED devices to fluoresce, and imaging the fluorescence of thearray of micro LED devices with the camera. An image produced form thecamera imaging fluorescence can be used to detect defective micro LEDdevices.

In an embodiment, a plurality of repair micro LED devices can betransferred to the display substrate adjacent (e.g. on the same bottomelectrodes) the plurality of irregularities prior to forming thepassivation layer material over the plurality of irregularities. Thiscan then be followed by forming one or more top electrode layers inelectrical contact with the array of micro LED devices and the pluralityof repair micro LED devices, without making electrical contact with theplurality of irregularities.

In an embodiment a method of forming a display panel with redundancyscheme includes electrostatically transferring an array of micro LEDdevice pairs from one or more carrier substrates to a correspondingarray of bottom electrodes within a corresponding array of subpixels ona display substrate. The surface of the display substrate is then imagedto detect irregularities in the array of micro LED device pairs. Apassivation layer material may then be formed over a plurality ofdetected irregularities to electrically insulate the plurality ofirregularities. One or more top electrode layers are then formed inelectrical contact with the array of micro LED device pairs.

One manner for electrostatic transfer includes electrostaticallytransferring a first array of micro LED devices from a first area of afirst carrier substrate to the display substrate, and electrostaticallytransferring a second array of micro LED devices from a second area ofthe first carrier substrate to the display substrate. For example, thefirst and second areas do not overlap in one embodiment to reduce theprobability of correlated defects being transferred to the samesubpixel. Another manner for electrostatic transfer includeselectrostatically transferring the first and second arrays of micro LEDdevices from different carrier substrates. In accordance withembodiments of the invention, electrostatic transfer can includeelectrostatically transferring each micro LED device with a separateelectrostatic transfer head.

In an embodiment, imaging the surface of the display surface comprisesimaging with a camera. For example, a line scan camera may be used. Inan embodiment, an image produced from the camera is used to detectirregularities in the array of micro LED device pairs, such as missingmicro LED devices or contaminated micro LED devices. In an embodiment,imaging the surface of the display substrate further includesilluminating the surface of the display substrate with a light source tocause the array of micro LED device pairs to fluoresce, and imaging thefluorescence of the array of micro LED device pairs with the camera todetect defective micro LED devices.

In an embodiment, a single top electrode layer is formed over the arrayof micro LED device pairs, including the irregularities. The passivationlayer material can cover the irregularities so that the top electrodelayer is not in electrical contact the irregularities.

In an embodiment, a plurality of separate top electrode layers areformed over the array of micro LED device pairs. The passivation layermaterial can be used to electrically insulate the irregularities fromthe top contact layers when formed directly over the irregularities. Thetop contact layers can also be formed around the irregularities so thatthey are not directly over the irregularities. Ink jet printing andscreen printing may be suitable deposition methods for forming both thepassivation layer material, as well as the top electrode layers. In anembodiment, a plurality of repair micro LED devices are transferred tothe display substrate adjacent the plurality of irregularities prior toforming the passivation layer material over the plurality ofirregularities. The top electrode layers may also be formed over and inelectrical contact with the repair micro LED devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view illustration of a top emission AMOLED displaypanel.

FIG. 2 is a side-view illustration of the top emission AMOLED displaypanel of FIG. 1 taken along lines X-X and Y-Y.

FIG. 3A is a top view illustration of an active matrix display panel inaccordance with an embodiment of the invention.

FIG. 3B is a side-view illustration of the active matrix display panelof FIG. 3A taken along lines X-X and Y-Y in accordance with anembodiment of the invention.

FIG. 3C is a side-view illustration of the active matrix display panelof FIG. 3A taken along lines X-X and Y-Y in accordance with anembodiment of the invention in which ground tie lines and ground ringare formed within a patterned bank layer.

FIG. 3D is a side-view illustration of the active matrix display panelof FIG. 3A taken along lines X-X and Y-Y in accordance with anembodiment of the invention in which ground tie lines and ground ringare formed below a patterned bank layer.

FIGS. 4A-4H are cross-sectional side view illustrations for a method oftransferring an array of micro LED devices to a TFT substrate inaccordance with an embodiment of the invention.

FIGS. 5A-5F are top view illustrations for a sequence of transferring anarray of micro LED devices with different color emissions in accordancewith an embodiment of the invention.

FIG. 6A is a top view illustration of an active matrix display panelafter the formation of a top electrode layer in accordance with anembodiment.

FIG. 6B is a top view illustration of an active matrix display panelafter the formation of separate top electrode layers in accordance withan embodiment.

FIG. 6C is a side-view illustration of the active matrix display panelof either FIG. 6A or FIG. 6B taken along lines X-X and Y-Y in accordancewith an embodiment of the invention.

FIG. 6D is a side-view illustration of the active matrix display panelof either FIG. 6A or FIG. 6B taken along lines X-X and Y-Y in accordancewith an embodiment of the invention.

FIG. 7 is a top view schematic illustration of a smart pixel displayincluding a redundancy and repair site configuration in accordance withan embodiment of the invention.

FIG. 8A is a schematic side view illustration of testing apparatusincluding a light source and camera in accordance with an embodiment ofthe invention.

FIG. 8B is a schematic top view illustration of a scanning pattern inaccordance with an embodiment of the invention.

FIG. 9 is a cross-sectional side view illustration of an exemplarystructure that can be formed after detection of a defective micro LEDdevice in accordance with an embodiment of the invention.

FIG. 10 is a cross-sectional side view illustration of an exemplarystructure that can be formed after detection of a missing micro LEDdevice in accordance with an embodiment of the invention.

FIG. 11 is a cross-sectional side view illustration of an exemplarystructure that can be formed after detection of a defective micro LEDdevice in accordance with an embodiment of the invention

FIG. 12 is a cross-sectional side view illustration of an exemplarystructure that can be formed after detection of a missing micro LEDdevice in accordance with an embodiment of the invention.

FIG. 13 is a top schematic view illustration of a top electrode layerformed over an array of micro LED devices including a variety ofconfigurations in accordance with an embodiment of the invention.

FIG. 14 is a top schematic view illustration of a plurality of separatetop electrode layers formed over an array of micro LED devices includinga variety of configurations in accordance with an embodiment of theinvention.

FIG. 15 is a top schematic view illustration of a plurality of separatetop electrode layers formed over an array of micro LED devices includinga variety of configurations in accordance with an embodiment of theinvention.

FIG. 16 is a top schematic view illustration of a scribed top electrodelayer in accordance with an embodiment of the invention.

FIG. 17 is a top schematic view illustration of a scribed bottomelectrode layer in accordance with an embodiment of the invention.

FIG. 18 is a schematic illustration of a display system in accordancewith an embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention relate to display systems. Moreparticularly embodiments of the present invention relate to a displaywith a redundancy scheme of light emitting diodes.

In one aspect, embodiments of the invention describe an active matrixdisplay panel including wafer-based emissive micro LED devices. A microLED device combines the performance, efficiency, and reliability ofwafer-based LED devices with the high yield, low cost, mixed materialsof thin film electronics used to form AMOLED backplanes. The terms“micro” device or “micro” LED structure as used herein may refer to thedescriptive size of certain devices or structures in accordance withembodiments of the invention. As used herein, the terms “micro” devicesor structures are meant to refer to the scale of 1 to 100 μm. However,it is to be appreciated that embodiments of the present invention arenot necessarily so limited, and that certain aspects of the embodimentsmay be applicable to larger, and possibly smaller size scales. In anembodiment, a display panel is similar to a typical OLED display panel,with a micro LED device having replaced the organic layer of the OLEDdisplay panel in each subpixel. Exemplary micro LED devices which may beutilized with some embodiments of the invention are described in U.S.patent application Ser. No. 13/372,222, U.S. patent application Ser. No.13/436,260, U.S. patent application Ser. No. 13/458,932, U.S. patentapplication Ser. No. 13/711,554, and U.S. patent application Ser. No.13/749,647 all of which are incorporated herein by reference. The microLED devices are highly efficient at light emission and consume verylittle power (e.g., 250 mW for a 10 inch diagonal display) compared to5-10 watts for a 10 inch diagonal LCD or OLED display, enablingreduction of power consumption of the display panel.

In another aspect, embodiments of the invention describe a redundancyscheme in which a plurality of bonding sites are available for bonding aplurality of micro LED devices on each bottom electrode, for example,within each bank opening for a subpixel. In an embodiment, theredundancy scheme includes at one or more bonding layers (e.g. indiumposts) at bonding sites on the bottom electrode within a bank opening,with each bonding layer designed to receive a separate micro LED device.In an embodiment, the redundancy scheme can also include a repairbonding site within the bank opening that is large enough to receive amicro LED device. The repair bonding site may also optionally include abonding layer. In this manner, in an embodiment, each bank opening maycorrespond to a single emission color of a subpixel, and receives aplurality of micro LED devices of the emission color. If one of themicro LED devices bonded to one of the bonding layers is defective, thenthe other micro LED device compensates for the defective micro LEDdevice. In addition, the repair bonding site may be used to bond anadditional micro LED device if desired. In this manner, a redundancy andrepair configuration is integrated into a backplane structure which canimprove emission uniformity across the display panel without having toalter the underlying TFT architecture already incorporated inconventional AMOLED displays.

In another aspect, embodiments of the invention describe an integratedtest method for detecting defective, missing, or contaminated micro LEDdevices after transfer of the micro LED devices from a carrier substrateto display substrate. In this manner, detection of defective, missing,or contaminated micro LED devices can be used to potentially transferreplacement micro LED devices where required, alter subsequentprocessing involved with passivating the micro LED devices and bottomelectrodes, or alter subsequent processing involved with forming the topelectrode layers. Furthermore, the integrated test method can beimplemented into the fabrication process so that it is not necessary toprovide a top electrical contact on the micro LED devices for testing,and a testing can be performed without separate electrical tests.

In various embodiments, description is made with reference to figures.However, certain embodiments may be practiced without one or more ofthese specific details, or in combination with other known methods andconfigurations. In the following description, numerous specific detailsare set forth, such as specific configurations, dimensions andprocesses, etc., in order to provide a thorough understanding of thepresent invention. In other instances, well-known semiconductorprocesses and manufacturing techniques have not been described inparticular detail in order to not unnecessarily obscure the presentinvention. Reference throughout this specification to “one embodiment”means that a particular feature, structure, configuration, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the invention. Thus, the appearances ofthe phrase “in one embodiment” in various places throughout thisspecification are not necessarily referring to the same embodiment ofthe invention. Furthermore, the particular features, structures,configurations, or characteristics may be combined in any suitablemanner in one or more embodiments.

The terms “spanning”, “over”, “to”, “between” and “on” as used hereinmay refer to a relative position of one layer with respect to otherlayers. One layer “spanning”, “over” or “on” another layer or bonded“to” or in “contact” with another layer may be directly in contact withthe other layer or may have one or more intervening layers. One layer“between” layers may be directly in contact with the layers or may haveone or more intervening layers.

It is to be appreciated that the following description is madespecifically with regard to active matrix display panels. However,embodiments are not so limited. In particular, embodiments describing aredundancy scheme, repair site, and testing method for detectingdefective, missing, or contaminated micro LED devices can also beimplemented into passive matrix display panels, as well as substratesfor lighting purposes.

Referring now to FIGS. 3A-3B an embodiment is illustrated in which abackplane similar to an AMOLED backplane is modified to receive emissivemicro LED devices rather than an organic emission layer. FIG. 3A is atop view illustration of an active matrix display panel in accordancewith an embodiment, and FIG. 3B is a side-view illustration of theactive matrix display panel of FIG. 3A taken along lines X-X and Y-Y inaccordance with an embodiment of the invention. In such an embodiment,the underlying TFT substrate 102 can be similar to those in a typicalAMOLED backplane described with regard to FIGS. 1-2 including workingcircuitry (e.g. T1, T2) and planarization layer 122. Openings 131 may beformed in the planarization layer 122 to contact the working circuitry.The working circuitry can include traditional 2T1C (two transistors, onecapacitor) circuits including a switching transistor, a drivingtransistor, and a storage capacitor. It is to be appreciated that the2T1C circuitry is meant to be exemplary, and that other types ofcircuitry or modifications of the traditional 2T1C circuitry arecontemplated in accordance with embodiments of the invention. Forexample, more complicated circuits can be used to compensate for processvariations of the driver transistor and the light emitting device, orfor their instabilities. Furthermore, while embodiments of the inventionare described and illustrated with regard to top gate transistorstructures in the TFT substrate 102, embodiments of the invention alsocontemplate the use of bottom gate transistor structures. Likewise,while embodiments of the invention are described and illustrated withregard to a top emission structure, embodiments of the invention alsocontemplate the use of bottom, or both top and bottom emissionstructures. In addition, embodiments of the invention are described andillustrated below specifically with regard to a high side driveconfiguration including ground tie lines and ground ring. In a high sidedrive configuration a LED may be on the drain side of a PMOS drivertransistor or a source side of an NMOS driver transistor so that thecircuit is pushing current through the p-terminal of the LED.Embodiments of the invention are not so limited may also be practicedwith a low side drive configuration in which case the ground tie linesand ground ring become the power line in the panel and current is pulledthrough the n-terminal of the LED.

A patterned bank layer 126 including bank openings 128 is then formedover the planarization layer 122. Bank layer 126 may be formed by avariety of techniques such as ink jet printing, screen printing,lamination, spin coating, CVD, and PVD. Bank layer 126 may be may beopaque, transparent, or semi-transparent to the visible wavelength. Banklayer 126 may be formed of a variety of insulating materials such as,but not limited to, photo-definable acrylic, photoresist, silicon oxide(SiO₂), silicon nitride (SiN_(x)), poly(methyl methacrylate) (PMMA),benzocyclobutene (BCB), polyimide, acrylate, epoxy, and polyester. In anembodiment, bank player is formed of an opaque material such as a blackmatrix material. Exemplary insulating black matrix materials includeorganic resins, glass pastes, and resins or pastes including a blackpigment, metallic particles such as nickel, aluminum, molybdenum, andalloys thereof, metal oxide particles (e.g. chromium oxide), or metalnitride particles (e.g. chromium nitride).

In accordance with embodiments of the invention, the thickness of thebank layer 126 and width of the bank openings 128 described with regardto the following figures may depend upon the height of the micro LEDdevices to be mounted within the opening, height of the transfer headstransferring the micro LED devices, and resolution. In an embodiment,the resolution, pixel density, and subpixel density of the display panelmay account for the width of the bank openings 128. For an exemplary 55inch television with a 40 PPI (pixels per inch) and 211 μm subpixelpitch, the width of the bank openings 128 may be anywhere from a fewmicrons to 206 μm to account for an exemplary 5 μm wide surrounding bankstructure. For an exemplary display panel with 440 PPI and a 19 μmsubpixel pitch, the width of the bank openings 128 may be anywhere froma few microns to 14 μm to account for an exemplary 5 μm wide surroundingbank structure. Width of the bank structure (i.e. between bank openings128) may be any suitable size, so long as the structure supports therequired processes and is scalable to the required PPI.

In accordance with embodiments of the invention, the thickness of thebank layer 126 is not too thick in order for the bank structure tofunction. Thickness may be determined by the micro LED device height anda predetermined viewing angle. For example, where sidewalls of the bankopenings 128 make an angle with the planarization layer 122, shallowerangles may correlate to a wider viewing angle of the system. In anembodiment, exemplary thicknesses of the bank layer 126 may be between 1μm-50 μm.

A patterned conductive layer is then formed over the patterned banklayer 126. Referring to FIG. 3B, in one embodiment the patternedconductive layer includes bottom electrodes 142 formed within the bankopenings 128 and in electrical contact with the working circuitry. Thepatterned conductive layer may also optionally include the ground tielines 144 and/or the ground ring 116. As used herein the term ground“ring” does not require a circular pattern, or a pattern that completelysurrounds an object. Rather, the term ground “ring” means a pattern thatat least partially surrounds the pixel area on three sides. In addition,while the following embodiments are described and illustrated withregard to a ground ring 116, it is to be appreciated that embodiments ofthe invention can also be practiced with a ground line running along oneside (e.g. left, right, bottom, top), or two sides (a combination of twoof the left, right, bottom, top) of the pixel area. Accordingly, it isto be appreciated that in the following description the reference to andillustration of a ground ring, could potentially be replaced with aground line where system requirements permit.

The patterned conductive layer may be formed of a number of conductiveand reflective materials, and may include more than one layer. In anembodiment, a patterned conductive layer comprises a metallic film suchas aluminum, molybdenum, titanium, titanium-tungsten, silver, or gold,or alloys thereof. The patterned conductive layer may include aconductive material such as amorphous silicon, transparent conductiveoxides (TCO) such as indium-tin-oxide (ITO) and indium-zinc-oxide (IZO),carbon nanotube film, or a transparent conducting polymer such aspoly(3,4-ethylenedioxythiophene) (PEDOT), polyaniline, polyacetylene,polypyrrole, and polythiophene. In an embodiment, the patternedconductive layer includes a stack of a conductive material and areflective conductive material. In an embodiment, the patternedconductive layer includes a 3-layer stack including top and bottomlayers and a reflective middle layer wherein one or both of the top andbottom layers are transparent. In an embodiment, the patternedconductive layer includes a conductive oxide-reflective metal-conductiveoxide 3-layer stack. The conductive oxide layers may be transparent. Forexample, the patterned conductive layer may include an ITO-silver-ITOlayer stack. In such a configuration, the top and bottom ITO layers mayprevent diffusion and/or oxidation of the reflective metal (silver)layer. In an embodiment, the patterned conductive layer includes aTi—Al—Ti stack, or a Mo—Al—Mo-ITO stack. In an embodiment, the patternedconductive layer includes a ITO-Ti—Al—Ti-ITO stack. In an embodiment,the patterned conductive layer is 1 μm or less in thickness. Thepatterned conductive layer may be deposited using a suitable techniquesuch as, but not limited to, PVD.

Following the formation of bottom electrodes 142, ground tie lines 144,and ground ring 116, an insulator layer 146 may then optionally beformed over the TFT substrate 102 covering the sidewalls of the patteredconductive layer. The insulator layer 146 may at least partially coverthe bank layer 126 and the reflective layer forming the bottomelectrodes 142, ground tie lines 144, and/or ground ring 116. In theembodiment illustrated the insulator layer 146 completely covers theground ring 116, however, this is optional.

In an embodiment, the insulator layer 146 is formed by blanketdeposition using a suitable technique such as lamination, spin coating,CVD, and PVD, and then patterned using a suitable technique such aslithography to form openings exposing the bottom electrodes 142 andopenings 149 exposing the ground tie lines 144. In an embodiment, inkjet printing or screen printing may be used to form the insulator layer146 and openings 149 without requiring lithography. Insulator layer 146may be formed of a variety of materials such as, but not limited to,SiO₂, SiN_(x), PMMA, BCB, polyimide, acrylate, epoxy, and polyester. Forexample, the insulator layer 146 may be 0.5 μm thick. The insulatorlayer 146 may be transparent or semi-transparent where formed over thereflective layer on sidewalls of bottom electrode 142 within the bankopenings 128 as to not significantly degrade light emission extractionof the completed system. Thickness of the insulator layer 146 may alsobe controlled to increase light extraction efficiency, and also to notinterfere with the array of transfer heads during transfer of the arrayof light emitting devices to the reflective bank structure. As willbecome more apparent in the following description, the patternedinsulator layer 146 is optional, and represents one manner forelectrically separating conductive layers.

In the embodiment illustrated in FIG. 3B, the bottom electrodes 142,ground tie lines 144, and ground ring 116 can be formed of the sameconductive layer. In another embodiment, the ground tie lines 144 and/orground ring 116 can be formed of a conductive material different fromthe bottom electrodes 142. For example, ground tie lines 14 and groundring 116 may be formed with a material having a higher conductivity thanthe bottom electrodes 142. In another embodiment, ground tie lines 14and/or ground ring 116 can also be formed within different layers fromthe bottom electrodes. FIGS. 3C-3D illustrate embodiments where theground tie lines 144 and ground ring 116 can be formed within or belowthe patterned bank layer 126. For example, in the embodiment illustratedin FIG. 3C, openings 149, 130 may be formed through the patterned banklayer 126 when forming the ground tie lines 144 and ground ring 116. Inthe embodiment illustrated in FIG. 3D openings 149 may be formed throughthe patterned bank layer 126 and planarization layer 122 to contact theground tie lines 144. In the embodiment, illustrated openings are notformed to expose the ground ring, however, in other embodiments openingscould be formed to expose the ground ring. In the embodiment illustratedin FIG. 3D, the ground ring and ground tie lines 144 may have beenformed during formation of the working circuitry of the TFT substrate102. In such an embodiment the conductive layer used to form the bottomelectrode 142 may also optionally include via opening layers 145 tofurther enable electrical contact of the top electrode layer yet to beformed with the ground tie lines 144 through openings 149. Accordingly,it is to be appreciated that the embodiments illustrated in FIGS. 3A-3Dare not limiting and that a number of possibilities exist for formingthe ground tie lines 144 and ground ring 116, as well as openings 149,130.

Still referring to embodiments illustrated in FIG. 3A-3D, a plurality ofbonding layers 140 may be formed on the bottom electrode layer 142 tofacilitate bonding of micro LED devices. In the specific embodimentillustrated two bonding layers 140 are illustrated for bonding two microLED devices. In an embodiment, the bonding layer 140 is selected for itsability to be inter-diffused with a bonding layer on the micro LEDdevice (yet to be placed) through bonding mechanisms such as eutecticalloy bonding, transient liquid phase bonding, or solid state diffusionbonding as described in U.S. patent application Ser. No. 13/749,647. Inan embodiment, the bonding layer 140 has a melting temperature of 250°C. or lower. For example, the bonding layer 140 may include a soldermaterial such as tin (232° C.) or indium (156.7° C.), or alloys thereof.Bonding layer 140 may also be in the shape of a post, having a heightgreater than width. In accordance with some embodiments of theinvention, taller bonding layers 140 may provide an additional degree offreedom for system component leveling, such as planarity of the array ofmicro LED devices with the TFT substrate during the micro LED devicetransfer operation and for variations in height of the micro LEDdevices, due to the change in height of the liquefied bonding layers asthey spread out over the surface during bonding, such as during eutecticalloy bonding and transient liquid phase bonding. The width of thebonding layers 140 may be less than a width of a bottom surface of themicro LEDs to prevent wicking of the bonding layers 140 around thesidewalls of the micro LEDs and shorting the quantum well structures.

In addition to bonding layers 140, the embodiments illustrated in FIGS.3A-3D include a repair bonding site 401 within each bank opening 128that is large enough to receive a micro LED device. In this manner, theplurality of bonding layers 140 and repair bonding site 401 create aredundancy and repair configuration within each bank opening 128. In theparticular embodiments illustrated in FIGS. 3A-3D the repair bondingsite 401 is illustrated as being a bare surface on the bottom electrodelayer 142. However, embodiments of the invention are not limited tosuch. In other embodiments, the repair bonding site 401 may also includea bonding layer 140 similarly as the other two bonding layers 140described and illustrated for the preexisting redundancy scheme.Accordingly, in some embodiments, bonding layers 140 are provided on thebottom electrode layer 142 at the sites of all of the intended micro LEDdevices in the redundancy scheme, as well as at the repair site 401.

In the embodiments illustrated an arrangement of ground tie lines 144may run between bank openings 128 in the pixel area 104 of the displaypanel 100. In addition, a plurality of openings 149 expose the pluralityof ground tie lines 144. The number of openings 149 may or may not havea 1:1 correlation to the number of columns (top to bottom) of bankopenings 128. For example, in the embodiment illustrated in FIG. 3A, aground tie opening 149 is formed for each column of bank openings 128,however, this is not required and the number of ground tie openings 149may be more or less than the number of columns of bank openings 128.Likewise, the number of ground tie lines 144 may or may not have a 1:1correlation to the number of rows (left to right) of bank openings. Forexample, in the embodiment illustrated a ground tie line 144 is formedfor every two rows of bank openings 128, however, this is not requiredand the number of ground tie lines 144 may have a 1:1 correlation, orany 1:n correlation to the number (n) of rows of bank openings 128.

While the above embodiments have been described an illustrated withground tie lines 144 running left and right horizontally across thedisplay panel 100, embodiments are not so limited. In other embodiments,the ground tie lines can run vertically, or both horizontally andvertically to form a grid. A number of possible variations areenvisioned in accordance with embodiments of the invention. It has beenobserved that operation of AMOLED configurations such as thosepreviously illustrated and described with regard to FIGS. 1-2 may resultin dimmer emission from the subpixels in the center of the pixel area,where the subpixels are furthest from the ground ring 116, compared tothe emission from subpixels at the edges of the pixel area closer to theground ring 116. In accordance with embodiments of the invention, groundtie lines are formed between the bank openings 128 in the pixel area andare electrically connected to the ground ring 116 or ground line in thenon-display area. In this manner, the ground signal may be moreuniformly applied to the matrix of subpixels, resulting in more uniformbrightness across the display panel 100. In addition, by forming theground tie lines 144 from a material having better electricalconductivity than the top electrode layer (which is yet to be formed),this may reduce the contact resistance in the electrical ground path.

FIGS. 4A-4H are cross-sectional side view illustrations for a method oftransferring an array of micro LED devices to the TFT substrate 102 inaccordance with an embodiment of the invention. Referring to FIG. 4A, anarray of transfer heads 302 supported by a transfer head substrate 300are positioned over an array of micro LED devices 400 supported on acarrier substrate 200. A heater 306 and heat distribution plate 304 mayoptionally be attached to the transfer head substrate 300. A heater 204and heat distribution plate 202 may optionally be attached to thecarrier substrate 200. The array of micro LED devices 400 are contactedwith the array of transfer heads 302, as illustrated in FIG. 4B, andpicked up from the carrier substrate 200 as illustrated in FIG. 4C. Inan embodiment, the array of micro LED devices 400 are picked up with anarray of transfer heads 302 operating in accordance with electrostaticprinciples, that is, they are electrostatic transfer heads.

FIG. 4D is a cross-sectional side view illustration of a transfer head302 holding a micro LED device 400 over a TFT substrate 102 inaccordance with an embodiment of the invention. In the embodimentillustrated, the transfer head 302 is supported by a transfer headsubstrate 300. As described above, a heater 306 and heat distributionplate 304 may optionally be attached to the transfer head substrate toapply heat to the transfer head 302. A heater 152 and heat distributionplate 150 may also, or alternatively, optionally be used to transferheat to the bonding layer 140 on the TFT substrate 102 and/or optionalbonding layer 410 on a micro LED device 400 described below.

Still referring to FIG. 4D, a close-up view of an exemplary micro LEDdevice 400 is illustrated in accordance with an embodiment. It is to beappreciated, that the specific micro LED device 400 illustrated isexemplary and that embodiments of the invention are not limited. In theparticular embodiment illustrated, the micro LED device 400 includes amicro p-n diode 450 and a bottom conductive contact 420. A bonding layer410 may optionally be formed below the bottom conductive contact 420,with the bottom conductive contact 420 between the micro p-n diode 450and the bonding layer 410. In an embodiment, the micro LED device 400further includes a top conductive contact 452. In an embodiment, themicro p-n diode 450 includes a top n-doped layer 414, one or morequantum well layers 416, and a lower p-doped layer 418. In otherembodiments, the arrangement of n-doped and p-doped layers can bereversed. The micro p-n diodes can be fabricated with straight sidewallsor tapered sidewalls. In certain embodiments, the micro p-n diodes 450possess outwardly tapered sidewalls 453 (from top to bottom). In certainembodiments, the micro p-n diodes 450 possess inwardly tapered sidewall(from top to bottom). The top and bottom conductive contacts 420, 452.For example, the bottom conductive contact 420 may include an electrodelayer and a barrier layer between the electrode layer and the optionalbonding layer 410. The top and bottom conductive contacts 420, 452 maybe transparent to the visible wavelength range (e.g. 380 nm-750 nm) oropaque. The top and bottom conductive contacts 420, 452 may optionallyinclude a reflective layer, such as a silver layer. The micro p-n diodeand conductive contacts may each have a top surface, a bottom surfaceand sidewalls. In an embodiment, the bottom surface 451 of the micro p-ndiode 450 is wider than the top surface of the micro p-n diode, and thesidewalls 453 are tapered outwardly from top to bottom. The top surfaceof the micro p-n diode 450 may be wider than the bottom surface of thep-n diode, or approximately the same width. In an embodiment, the bottomsurface 451 of the micro p-n diode 450 is wider than the top surface ofthe bottom conductive contact 420. The bottom surface of the micro p-ndiode may also be approximately the same width as the top surface of thebottom conductive contact 420. In an embodiment, the micro p-n diode 450is several microns thick, such as 3 μm or 5 μm, the conductive contacts420, 452 are 0.1 μm-2 μm thick, and the optional bonding layer 410 is0.1 μm-1 μm thick. In an embodiment, a maximum width of each micro LEDdevice 400 is 1-100 μm, for example, 30 μm, 10 μm, or 5 μm. In anembodiment, the maximum width of each micro LED device 400 must complywith the available space in the bank opening 128 for a particularresolution and PPI of the display panel.

FIG. 4E is a cross-sectional side view illustration of an array oftransfer heads holding an array micro LED devices 400 over a TFTsubstrate 102 accordance with an embodiment of the invention. FIG. 4E issubstantially similar to the structure illustrated in FIG. 4D with theprimary difference being the illustration of the transfer of an array ofmicro LED devices as opposed to a single micro LED device within thearray of micro LED devices.

Referring now to FIG. 4F the TFT substrate 102 is contacted with thearray of micro LED devices 400. In the embodiment illustrated,contacting the TFT substrate 102 with the array of micro LED devices 400includes contacting bonding layer 140 with a micro LED device bondinglayer 410 for each respective micro LED device. In an embodiment, eachmicro LED device bonding layer 410 is wider than a corresponding bondinglayer 140. In an embodiment energy is transferred from the electrostatictransfer head assembly and through the array of micro LED devices 400 tobond the array of micro LED devices 400 to the TFT substrate 102. Forexample, thermal energy may be transferred to facilitate several typesof bonding mechanisms such as eutectic alloy bonding, transient liquidphase bonding, and solid state diffusion bonding. The transfer ofthermal energy may also be accompanied by the application of pressurefrom the electrostatic transfer head assembly.

Referring to FIG. 4G, in an embodiment, the transfer of energy liquefiesbonding layer 140. The liquefied bonding layer 140 may act as a cushionand partially compensate for system uneven leveling (e.g. nonplanarsurfaces) between the array of micro devices 400 and the TFT substrateduring bonding, and for variations in height of the micro LED devices.In the particular implementation of transient liquid phase bonding theliquefied bonding layer 140 inter-diffuses with the micro LED devicebonding layer 410 to form an inter-metallic compound layer with anambient melting temperature higher than the ambient melting temperatureof the bonding layer 140. Accordingly, transient liquid phase bondingmay be accomplished at or above the lowest liquidus temperature of thebonding layers. In some embodiments of the invention, the micro LEDdevice bonding layer 410 is formed of a material having a meltingtemperature above 250° C. such as bismuth (271.4° C.), or a meltingtemperature above 350° C. such as gold (1064° C.), copper (1084° C.),silver (962° C.), aluminum (660° C.), zinc (419.5° C.), or nickel (1453°C.), and the TFT substrate bonding layer 140 has a melting temperaturebelow 250° C. such as tin (232° C.) or indium (156.7° C.).

In this manner, the substrate 150 supporting the TFT substrate 102 canbe heated to a temperature below the melting temperature of the bondinglayer 140, and the substrate 304 supporting the array of transfer headsis heated to a temperature below the melting temperature of bondinglayer 410, but above the melting temperature of bonding layer 140. Insuch an embodiment, the transfer of heat from the electrostatic transferhead assembly through the array of micro LED devices 400 is sufficientto form the transient liquid state of bonding layer 140 with subsequentisothermal solidification as an inter-metallic compound. While in theliquid phase, the lower melting temperature material both spreads outover the surface and diffused into a solid solution of the highermelting temperature material or dissolves the higher melting temperaturematerial and solidifies as an inter-metallic compound. In a specificembodiment, the substrate 304 supporting the array of transfer heads isheld at 180° C., bonding layer 410 is formed of gold, and bonding layer140 is formed of indium.

Following the transfer of energy to bond the array of micro LED devices400 to the TFT substrate, the array of micro LED devices 400 arereleased onto the receiving substrate and the array of electrostatictransfer heads are moved away as illustrated in FIG. 4H. Releasing thearray of micro LED devices 400 may be accomplished with a variety ofmethods including turning off the electrostatic voltage sources,lowering the voltage across the electrostatic transfer head electrodes,changing a waveform of an AC voltage, and grounding the voltage sources.

Referring now to FIGS. 5A-5F, a sequence of transferring an array ofmicro LED devices 400 with different color emissions is illustrated inaccordance with an embodiment of the invention. In the particularconfiguration illustrated in FIG. 5A, a first transfer procedure hasbeen completed for transferring an array of red-emitting micro LEDdevices 400R from a first carrier substrate to the TFT substrate 102.For example, where the micro LED devices 400R are designed to emit a redlight (e.g. 620-750 nm wavelength) the micro p-n diode 450 may include amaterial such as aluminum gallium arsenide (AlGaAs), gallium arsenidephosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), andgallium phosphide (GaP). Referring to FIG. 5B, a second transferprocedure has been completed for transferring a redundant array ofred-emitting micro LED devices 400R. For example, the redundant arraycould be transferred from a different carrier substrate, or from adifferent area (e.g. from opposite side, different areas do not overlap,or random selection) of the first carrier substrate in order to decreasethe probability of transferring a second array from a same correlateddefect area or contaminated area (e.g. particulates) of the firstcarrier substrate. In this manner, by transferring from two uncorrelatedareas it may be possible to reduce the likelihood of transferring twodefective micro LED devices 400 to the same bank structure 128, oralternatively transferring no micro LED devices 400 to a single bankstructure 128 because it was not possible to pick up the micro LEDdevices in a defective or contaminated area of a carrier substrate. Inyet another embodiment, by using a redundant array from two differentwafers it may be possible to obtain a mix of both colors, and tune theaverage power consumption of the display based upon a pre-existingknowledge of the primary emission wavelength of the micro LED devices ondifferent wafers. For example, where the first wafer is known to have anaverage red emission of 630 nm with a first power consumption while asecond wafer is known to have an average red emission of 610 emissionwith a second power consumption, the redundancy array can be composed ofmicro LED devices from both wafers to obtain an average powerconsumption or alternate color gamut.

Referring to FIG. 5C, a third transfer procedure has been completed fortransferring an array of green-emitting micro LED devices 400G from asecond carrier substrate to the TFT substrate 102. For example, wherethe micro LED devices 400G are designed to emit a green light (e.g.495-570 nm wavelength) the micro p-n diode 450 may include a materialsuch as indium gallium nitride (InGaN), gallium nitride (GaN), galliumphosphide (GaP), aluminum gallium indium phosphide (AlGaInP), andaluminum gallium phosphide (AlGaP). A fourth transfer procedure fortransferring a redundant array of green-emitting micro LED devices 400Gis illustrated in FIG. 5D, similarly as before.

Referring to FIG. 5E, a fifth transfer procedure has been completed fortransferring an array of blue-emitting micro LED devices 400B from athird carrier substrate to the TFT substrate 102. For example, where themicro LED devices 400B are designed to emit a blue light (e.g. 450-495nm wavelength) the micro p-n diode 450 may include a material such asgallium nitride (GaN), indium gallium nitride (InGaN), and zinc selenide(ZnSe). A sixth transfer procedure for transferring a redundant array ofblue-emitting micro LED devices 400B is illustrated in FIG. 5F,similarly as before.

In the particular embodiments described above with regard to FIGS.5A-5F, the first and second micro LED devices 400 for each subpixel areseparately transferred. For example, this may reduce the probability ofcorrelated defects. However, in other embodiments it is possible tosimultaneously transfer the first and second micro LED devices from thesame carrier substrate. In this manner, simultaneous transfer mayincrease production throughput while still offering some of the benefitsof a redundancy scheme at the expense of the possibility of correlateddefects due to transferring micro LED devices from the same area of acarrier substrate. In such an embodiment the processing sequence wouldresemble the sequence in the following order of FIG. 5B, 5D, 5F.

In accordance with embodiments of the invention, the transfer heads areseparated by a pitch (x, y, and/or diagonal) that matches a pitch of thebank openings on the backplane corresponding to the pixel or subpixelarray. Table 1 provides a list of exemplary implementations inaccordance with embodiments of the invention for various red-green-blue(RGB) displays with 1920×1080p and 2560×1600 resolutions. It is to beappreciated that embodiments of the invention are not limited to RGBcolor schemes or the 1920×1080p or 2560×1600 resolutions, and that thespecific resolution and RGB color scheme is for illustrational purposesonly.

TABLE 1 Pixel Sub-Pixel Pixels Display Pitch pitch per inch Substrate(x, y) (x, y) (PPI) Possible transfer head array pitch 55″ (634 μm, (211μm, 40 X: Multiples or fractions of 211 μm 1920 × 1080 634 μm) 634 μm)Y: Multiples or fractions of 634 μm 10″ (85 μm, (28 μm, 299 X: Multiplesor fractions of 28 μm 2560 × 1600 85 μm) 85 μm) Y: Multiples orfractions of 85 μm  4″ (78 μm, (26 μm, 326 X: Multiples or fractions of26 μm  640 × 1136 78 μm) 78 μm) Y: Multiples or fractions of 78 μm  5″(58 μm, (19 μm, 440 X: Multiples or fractions of 19 μm 1920 × 1080 58μm) 58 μm) Y: Multiples or fractions of 58 μm

In the above exemplary embodiments, the 40 PPI pixel density maycorrespond to a 55 inch 1920×1080p resolution television, and the 326and 440 PPI pixel density may correspond to a handheld device withRETINA® display. In accordance with embodiments of the invention,thousands, millions, or even hundreds of millions of transfer heads canbe included in a micro pick up array of a mass transfer tool dependingupon the size of the micro pick up array. In accordance with embodimentsof the invention, a 1 cm×1.12 cm array of transfer heads can include 837transfer heads with a 211 μm, 634 μm pitch, and 102,000 transfer headswith a 19 μm, 58 μm pitch.

The number of micro LED devices picked up with the array of transferheads may or may not match the pitch of transfer heads. For example, anarray of transfer heads separated by a pitch of 19 μm picks up an arrayof micro LED devices with a pitch of 19 μm. In another example, an arrayof transfer heads separated by a pitch of 19 μm picks up an array ofmicro LED devices with a pitch of approximately 6.33 μm. In this mannerthe transfer heads pick up every third micro LED device for transfer tothe backplane. In accordance with some embodiments, the top surface ofthe array of light emitting micro devices is higher than the top surfaceof the insulating layer so as to prevent the transfer heads from beingdamaged by or damaging the insulating layer (or any intervening layer)on the blackplane during placement of the micro LED devices within bankopenings.

FIG. 6A is a top view illustration of an active matrix display panel inaccordance with an embodiment after the formation of a top electrodelayer. FIG. 6B is a top view illustration of an active matrix displaypanel in accordance with an embodiment after the formation of separatetop electrode layers. FIGS. 6C-6D are side-view illustrations of theactive matrix display panel of either FIG. 6A or FIG. 6B taken alonglines X-X and Y-Y in accordance with embodiments of the invention. Inaccordance with the embodiments illustrated in FIGS. 6A-6B, one or moretop electrode layers 118 are formed over the pixel area 104 includingthe array of micro LED devices 400, as well as formed within theopenings 149 and in electrical contact with the ground tie lines 144running between the bank openings 128 in the pixel area 104.

Referring now to FIGS. 6C-6D, prior to forming the one or more topelectrode layers 118 the micro LED devices 400 are passivated within thebank openings 128 in order to prevent electrical shorting between thetop and bottom electrode layers 118, 142, or shorting at the one or morequantum wells 416. As illustrated, after the transfer of the array microLED devices 400, a passivation layer 148 may be formed around thesidewalls of the micro LED devices 400 within the array of bank openings128. In an embodiment, where the micro LED devices 400 are vertical LEDdevices, the passivation layer 148 covers and spans the quantum wellstructure 416. The passivation layer 148 may also cover any portions ofthe bottom electrode layer 142 not already covered by the optionalinsulator layer 146 in order to prevent possible shorting. Accordingly,the passivation layer 148 may be used to passivate the quantum wellstructure 416, as well as the bottom electrode layer 142. In accordancewith embodiments of the invention, the passivation layer 148 is notformed on the top surface of the micro LED devices 400, such as topconductive contact 452. In one embodiment, a plasma etching process,e.g. O₂ or CF₄ plasma etch, can be used after forming the passivationlayer 148 to etch back the passivation layer 148, ensuring the topsurface of the micro LED devices 400, such as top conductive contacts452, are exposed to enable the top conductive electrode 118 layers 118to make electrical contact with the micro LED devices 400.

In accordance with embodiments of the invention, the passivation layer148 may be transparent or semi-transparent to the visible wavelength soas to not significantly degrade light extraction efficiency of thecompleted system. Passivation layer may be formed of a variety ofmaterials such as, but not limited to epoxy, acrylic (polyacrylate) suchas poly(methyl methacrylate) (PMMA), benzocyclobutene (BCB), polyimide,and polyester. In an embodiment, passivation layer 148 is formed by inkjet printing or screen printing around the micro LED devices 400.

In the particular embodiment illustrated in FIG. 6C, the passivationlayer 148 is only formed within the bank openings 128. However, this isnot required, and the passivation layer 148 may be formed on top of thebank structure layer 126. Furthermore, the formation of insulator layer146 is not required, and passivation layer 148 can also be used toelectrically insulate the conductive layers. As shown in the embodimentillustrated in FIG. 6D, the passivation layer 148 may also be used topassivate sidewalls of the conductive layer forming the bottom electrode142 and ground tie lines 144. In an embodiment, passivation layer 148may optionally be used to passivate ground ring 116. In accordance withsome embodiments, the formation of openings 149 can be formed during theprocess of ink jet printing or screen printing the passivation layer 148over the ground tie lines 144. Openings may also optionally be formedover the ground ring 116. In this manner, a separate patterningoperation may not be required to form the openings.

In accordance with some embodiments of the invention a canal 151, orwell structure, can be formed within the bank layer 126 as illustratedin FIG. 6C in order to capture or prevent the passivation layer 148 fromspreading excessively and overflowing over the ground tie lines 144,particularly when the passivation layer 148 is formed using a solventsystem such as with ink jet printing or screen printing. Accordingly, insome embodiments, a canal 151 is formed within the bank layer 126between the bank opening 128 and an adjacent ground tie line 144.

Still referring to FIGS. 6C-6D, after formation of passivation layer 148one or more top conductive electrode layers 118 are formed over eachmicro LED device 400 and in electrical contact with the top contactlayer 452, if present. Depending upon the particular application in thefollowing description, top electrode layers 118 may be opaque,reflective, transparent, or semi-transparent to the visible wavelength.For example, in top emission systems the top electrode layer 118 may betransparent, and for bottom emission systems the top electrode layer maybe reflective. Exemplary transparent conductive materials includeamorphous silicon, transparent conductive oxides (TCO) such asindium-tin-oxide (ITO) and indium-zinc-oxide (IZO), carbon nanotubefilm, or a transparent conductive polymer such aspoly(3,4-ethylenedioxythiophene) (PEDOT), polyaniline, polyacetylene,polypyrrole, and polythiophene. In an embodiment, the top electrodelayer 118 includes nanoparticles such as silver, gold, aluminum,molybdenum, titanium, tungsten, ITO, and IZO. In a particularembodiment, the top electrode layer 118 is formed by ink jet printing orscreen printing ITO or a transparent conductive polymer such as PEDOT.Other methods of formation may include chemical vapor deposition (CVD),physical vapor deposition (PVD), spin coating. The top electrode layer118 may also be reflective to the visible wavelength. In an embodiment,a top conductive electrode layer 118 comprises a reflective metallicfilm such as aluminum, molybdenum, titanium, titanium-tungsten, silver,or gold, or alloys thereof, for example for use in a bottom emissionsystem.

In accordance with some embodiments of the invention the ground tielines 144 may be more electrically conductive than the top electrodelayer 118. In the embodiment illustrated in FIG. 3D, the ground tielines 144 can be formed from the same metal layer used to formed thesource/drain connections or gate electrode to one of the transistors(e.g. T2) in the TFT substrate 102. For example, the ground tie lines144 can be formed from a common interconnect material such as copper oraluminum, including their alloys. In the embodiments illustrated inFIGS. 3B-3C and FIGS. 6C-6D, the ground tie lines 144 may also be formedfrom the same material as the bottom electrode layers 142. For example,the ground tie lines 144 and bottom electrode layers 142 include areflective material, which may also improve the electrical conductivityof the layers. In a specific example, the ground tie lines 144 andbottom electrodes may include a metallic film or metal particles. Inaccordance with some embodiments, the top electrode layer 118 is formedof a transparent or semi-transparent material such as amorphous silicon,transparent conductive oxides (TCO) such as indium-tin-oxide (ITO) andindium-zinc-oxide (IZO), carbon nanotube film, or a transparentconductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT),polyaniline, polyacetylene, polypyrrole, and polythiophene, all of whichmay have a lower electrical conductivity than a conductive andreflective bottom electrode layer including a metallic film within afilm stack.

Referring back to FIG. 6A again, in the particular embodimentillustrated a top electrode layer 118 is formed over the pixel area 104including the array of micro LED devices 400. The top electrode layer118 may also be formed within the openings 149, if present, and inelectrical contact with the ground tie lines 144 running between thebank openings 128 in the pixel area 104. In such an embodiment, sincethe ground tie lines 144 are in electrical connection with the groundring 116, it is not necessary to form the top electrode layer 118outside of the pixel area 104. As illustrated, the ground ring 116 maybe buried beneath an electrically insulating layer such as such asinsulator layer 146, passivation layer 148, or even bank structure layer126 or planarization layer 122. While FIG. 6A is described andillustrates as including the top electrode layer 118 only over the pixelarea 104, and including ground tie lines 144 embodiments of theinvention are not so limited. For example, ground tie lines 144 are notnecessary to establish a redundancy scheme and repair site, nor is itrequired that the top electrode layer not be formed over and inelectrical contact with the ground ring 116, or ground line.

FIG. 6B illustrates an alternative embodiment in which separate topelectrode layers 118 are formed connecting one or more micro LED devices400 with one or more ground tie lines 144. In the particular embodimentillustrated in FIG. 6B, the top electrode layers 118 only need toprovide the electrical path from a micro LED device 400 to a nearbyground tie line 144. Accordingly, it is not required for the topelectrode layers 118 to cover the entire pixel area 104, or even theentire bank openings 128 for that matter. In the particular embodimentillustrated, each top electrode layer 118 connects the micro LED devices400 within a pair of bank openings on opposite sides of an intermediateground tie line 144. However, this particular configuration is exemplaryand a number of different arrangements are possible. For example, asingle top electrode layer 118 may run over, and electrically connect ann-number of rows of micro LED devices, or bank openings 128, to theground tie lines or ground ring. As illustrated, the top electrode layer118 may be formed within openings 149 to the ground tie lines 144. Insuch an embodiment, since the ground tie lines 144 are in electricalconnection with the ground ring 116, it is not necessary to form the topelectrode layer 118 outside of the pixel area 104.

As illustrated, the ground ring 116 may be buried beneath anelectrically insulating layer such as such as insulator layer 146 inaccordance with the embodiments illustrated in FIGS. 6A-6B. In theparticular embodiments illustrated in FIG. 6B, topmost row of micro LEDdevices 400 are illustrated as being connected to the ground ring 116with individual top electrode layers 118. In such an embodiment, eachtop electrode layer 118 may contact the ground ring 116 through one ormore openings as previously described. Accordingly, while theembodiments illustrated in FIGS. 6A-6B provide one manner for connectingthe micro LED devices 400 to ground tie lines 144 within the pixel area104, this does not preclude using separate top electrode layers 118 toconnect to the ground ring 116 without going through a ground tie line144.

As illustrated in FIGS. 6A-6B, line width for the top electrode layers118 can vary depending upon application. For example, the line width mayapproach that of the pixel area 104. Alternatively, the line width maybe minimal. For example, line widths as low as approximately 15 μm maybe accomplished with commercially available ink jet printers, and linewidths as low as approximately 30 μm may be accomplished withcommercially available screen printers. Accordingly, the line width ofthe top electrode layers 118 may be more or less than the maximum widthof the micro LED devices.

In another aspect, the embodiments of the invention may be particularlysuitable for localized formation of the top electrode layers 118 withink jet printing or screen printing. Ink jet printing in particular maybe suitable since it is a non-contact printing method. ConventionalAMOLED backplane processing sequences such as those used for thefabrication of the display panels in FIGS. 1-2 typically blanket depositthe top electrode layer in deposition a chamber, followed by singulationof the individual backplanes 100 from a larger substrate. In accordancewith some embodiments, the display panel 100 backplane is singulatedfrom a larger substrate prior to transferring the array of micro LEDdevices 400. In an embodiment, ink jet printing or screen printingprovides a practical approach for patterning the individual topelectrode layers 118 without requiring a separate mask layer for eachseparate display panel 100.

FIG. 7 is a top view schematic illustration of a smart pixel displayincluding a redundancy and repair site configuration in accordance withan embodiment of the invention. As shown the display panel 200 includesa substrate 201 which may be opaque, transparent, rigid, or flexible. Asmart pixel area 206 may include separate subpixels of differentemission colors, and a micro controller chip 208 including the workingcircuitry described above with regard to the TFT substrate. In thismanner, rather than forming the pixel area on a TFT substrate includingthe working circuitry, the micro LED devices 400 and micro controllerchip 208 are both transferred to the same side or surface of thesubstrate 201. Electrical distribution lines can connect the microcontroller chip 208 to the data driver circuit 110 and scan drivercircuit 112 similarly as with a TFT substrate. Likewise, bank layerstructures can be formed on the substrate 201 similarly as describedabove for the TFT substrate to contain the micro LED devices 400 andrepair bonding site 401. Similarly, a top electrode layer 118, orseparate top electrode layers 118 can connect the micro LED devices 400to a ground tie line 144 or ground ring 116 similarly as described abovewith regard to the TFT substrate configuration. Thus, similar redundancyand repair site configurations can be formed with the smart pixelconfiguration as described above for the TFT substrate configurations.

Up until this point the redundancy and repair site configurations havebeen described without regard to whether any testing has been performedto detect defective, missing, or contaminated micro LED devices, orwhether any repair options have been performed. Thus, up until thispoint embodiments of the invention have been described and illustratedassuming 100% transfer success of the micro LED devices to the displaysubstrate, with no repair required. However, in practical application,it is not expected to always achieve 100% transfer success, and with nodefective, missing, or contaminated micro LED devices. In accordancewith embodiments of the invention, micro LED devices may be of 1 to 100μm in scale, for example, having a maximum width of approximately 20 μm,10 μm, or 5 μm. Such micro LED devices are fabricated so that they arepoised for pick up from a carrier substrate and transfer to the displaysubstrate, for example, using an array of electrostatic transfer heads.Defective micro LED devices may result from a variety of reasons, suchas contamination, stress fractures, and shorting between conductivelayers. Micro LED devices also may not be picked up during the transferoperation due to a variety of reasons, such as non-planarity of thecarrier substrate, contamination (e.g. particulates), or irregularadhesion of the micro LED devices to the carrier substrate.

FIGS. 8A-8B illustrate an integrated testing method in accordance withembodiments of the invention for detecting defective, missing, orcontaminated micro LED devices after transfer of the micro LED devicesfrom the carrier substrate to display substrate, such as the transferoperations illustrated in FIGS. 5A-5F, and prior to formation of thepassivation layer 148 and top electrode layers 118. In this manner,detection of defective, missing, or contaminated micro LED devices canbe used to potentially alter the deposition patterns of the passivationlayer 148 and top electrode layers 118, and to potentially transferreplacement micro LED devices where required. Referring now to FIG. 8A,a carriage 802 supporting a light source 804 and camera 806 are scannedover the display substrate carrying the array of micro LED devices 400which have been transferred and bonded to the bottom electrode layer142.

In an embodiment, camera 806 is a line scan camera. For example, linescan cameras typically have a row of pixel sensors that can be used toprovide a continuous feed to a computer system that joins the frames tomake an image as the line scan camera is passed over an imaging surface.In an embodiment, camera 806 is a two dimensional (2D) camera havingboth x-y dimensions of pixels. In accordance with embodiments of theinvention, camera 806 should have a resolution capable of imaging themicro LED devices 400, for example, having a maximum width of 1-100 μm.Resolution may be determined by the pixel size in the pixel sensors, andmay be aided by the use of optics to increase the resolution. By way ofexample, in one embodiment, the micro LED devices 400 have a maximumwidth of approximately 5 μm. One exemplary line scan camera 806 whichmay be used is the BASLER RUNNER SERIES CAMERA (available from Basler AGof Ahrensburg, Germany) having a pixel size of 3.5 μm. With the additionof optics, this can allow for resolution down to approximately 1.75 μmfor a 3.5 μm pixel size. Line scan cameras can also be selected fortheir line scan speed, and line scan width. For example, line scanspeeds are achievable up to several meters per second, and line scanwidths of are commonly available between 10 and 50 mm.

In one embodiment, the light source 804 is used for illuminating thesurface to be scanned. For example, in one embodiment, the camera 806 isscanned over the substrate 201, 102 surface in order to verify whetheror a micro LED device 400 has been placed in an intended location. Inthis manner, the camera 806 can be used to detect successful transferfor each micro LED device 400 from a carrier substrate to the displaysubstrate 201, 102.

In another embodiment, light source 804 is used to emit an excitationwavelength of light to induce photoluminescence of the micro LED devices400. The light source 804 may be a variety of light sources such as, butnot limited to, LED lighting or excimer laser. In this manner, the linescan camera 806 can be used to detect specific emission wavelengths fromthe micro LED devices 400 that exhibit either no emission, or irregularemission. Accordingly, this information can be used to detect defects inthe micro LED devices 400 that are otherwise not easily curable on thecarrier substrate. As described above, the carrier substrate may includethousands, or millions of micro LED devices 400 that are poised for pickup and transfer. A variety of defects can arise during processing andintegration of the micro LED devices 400 on the carrier substrate. Thesedefects could potentially cause shorting or non-uniform emission oncetransferred to the display substrate 201, 102. However, it may not beoptimal to cure individual defective micro LED devices 400 when they areon the carrier substrate. If a micro LED device 400 is defective on thecarrier substrate, it may simply be more efficient to cure the defectwith a redundancy scheme or repair site on the display substrate 201,102 in accordance with embodiments of the invention.

In an embodiment, light source 804 emits a shorter wavelength of lightthan the wavelength of light that the target micro LED devices aredesigned to emit, to induce red shifting or fluorescence of light fromthe micro LED devices. In accordance with embodiments of the invention,the light source 804 may be tunable, or multiple light sources set to adesired wavelength are provided. For example, an excitation wavelengthof 500-600 nm may be used to induce emission of red light (e.g. 620-750nm wavelength) from the red-emitting micro LED devices 400R, anexcitation wavelength of 430-470 nm may be used to induce emission ofgreen light (e.g. 495-570 nm wavelength) from a the green-emitting microLED devices 400G, and an excitation wavelength of 325-425 nm may be usedto induce emission of blue light (e.g. 450-495 nm wavelength) from theblue-emitting micro LED devices 400B. However, these ranges areexemplary and not exclusive. In some instances it may be useful toprovide a color filter 808 over the line scan camera 806 so that only aselect range of wavelengths are detected. This can reduce dilutionresulting from light emission from micro LED devices of differentcolors.

Referring now to FIG. 8B, an embodiment is illustrated for scanning asubstrate 201, 102 after bonding of the array of micro LED devices. Insuch an embodiment, the exemplary substrate is approximately 100 mmwide, and a line scan camera with line scan width of approximately 20 mmis provided. As illustrated, the substrate 201, 102 can be scanned usinga total of 3 passes to cover the entire surface of the substrate 201,102. In one embodiment, the line scan camera 806 is a multi-color cameraand is capable of simultaneously imaging all of the red, green, and bluemicro LED devices 400 assuming the light source(s) 204 provide therequired excitation wavelengths to excite all of the micro LED devices.In another embodiment, only a single excitation wavelength or range isprovided to target a specific micro LED device emission color. In suchan embodiment, it may be required to scan the substrate 201, 102 threeseparate times, at the three separate excitation wavelengths to imageall of the micro LED devices 400. However, at line scan speeds of up toseveral meters per second, the practical difference in time required formultiple scans may be inconsequential.

In an embodiment, substrate 201, 102 is scanned using a stepped imagecapture method. For example, the camera is moved a known distancebetween subpixels, or moved a known distance between the known bondingsites of the micro LED devices between image capture. In such anembodiment, the camera can be a line scan camera. In an embodiment, thecamera can be a camera including an x-y array of pixels to capturemosaics or selected tiles. Stepped image capture operation of the cameraallows for testing flexibility for specific regions of the substratesurface, and may be particularly suitable for comparing measured spacedapart micro LED devices to nominal patterns. Accordingly, the camera canbe moved in a pattern to capture specific locations rather than scanningin a line.

A number of possible processing variations can follow based upon theresults of the integrated detection test described with regard to FIGS.8A-8B. Specifically, in some embodiments, the patterning of passivationlayer 148 and top electrode layer 118 can be tailored to the specificresults, particularly when deposited by ink jet printing.

FIG. 9 is a cross-sectional side view illustration of an exemplarystructure that can be formed after detection of a defective orcontaminated micro LED device 400X, in accordance with an embodiment ofthe invention. In the embodiment illustrated, micro LED device 400 wasfound functional (e.g. proper emission) in a detection test, and microLED device 400X was found defective. Alternatively, or in addition, adetection test indicated that micro LED device 400X was contaminated(e.g. particle on top surface could prevent obtaining contact with topelectrode layer). Since the defect detection test does not necessarilydetermine what the defect is, in the embodiment illustrated, thepassivation layer 148 may simply be formed over the micro LED device400X to fully passivate the micro LED device 400X so that it is notpossible for the top electrode layer 118 to make electrical contact withthe defective or contaminated micro LED device 400X.

FIG. 10 is a cross-sectional side view illustration of an exemplarystructure that can be formed after detection of a missing micro LEDdevice, in accordance with an embodiment of the invention. In theembodiment illustrated, the detection test indicated that a micro LEDdevice was not transferred. As a result, passivation layer 118 is formedover the bonding layer 140 to that it is not possible for the topelectrode layer 118 to make electrical contact with the bottom electrode142.

FIG. 11 is a cross-sectional side view illustration of an exemplarystructure that can be formed after detection of a defective orcontaminated micro LED device 400X, in accordance with an embodiment ofthe invention. As illustrated, prior to forming the passivation layer148, a replacement micro LED device 400 can be bonded to the previouslyopen repair bonding site 401 on the bottom electrode 142. As previouslydescribed, the repair bonding site 401 may be a bare surface on thebottom electrode layer 142, or alternatively may include a bonding layer140. Following placement of the replacement micro LED device 400, thepassivation layer 148 may be formed to passivate the quantum wellstructures of the micro LED devices 400, bottom electrode 142, andoptionally the exposed surfaces of the defective or contaminated microLED device 400X as described above with regard to FIG. 9. Top electrode118 may then be formed to make electrical contact with the micro LEDdevice 400 and replacement micro LED device 400.

FIG. 12 is a cross-sectional side view illustration of an exemplarystructure that can be formed after detection of a missing micro LEDdevice, in accordance with an embodiment of the invention. Asillustrated, prior to forming the passivation layer 148, a replacementmicro LED device 400 can be bonded to the previously open repair bondingsite 401 on the bottom electrode 142. Following placement of thereplacement micro LED device 400, the passivation layer 148 may beformed over the bonding layer 140 to that it is not possible for the topelectrode layer 118 to make electrical contact with the bottom electrode142. Top electrode 118 may then be formed to make electrical contactwith the micro LED device 400 and replacement micro LED device 400.

FIG. 13 is a top schematic view illustration of an array of micro LEDdevices including a variety of configurations described in FIGS. 9-12 inaccordance with embodiments of the invention. In the particularembodiments illustrated in FIG. 13, a top electrode layer 118 is formedover a plurality of bank openings 128, and may be formed over aplurality of subpixels or pixels 106. In an embodiment, the topelectrode layer 118 is formed over all of the micro LED devices 400 inthe pixel area.

The embodiment illustrated in FIG. 9 is also illustrated as one of theblue-emitting subpixels in FIG. 13 where the top electrode layer 118 isformed over both the blue emitting micro LED device 400, and thedefective or contaminated micro LED device 400X, where the defective orcontaminated micro LED device 400X is covered with the passivation layer148.

The embodiment illustrated in FIG. 10 is also illustrated as one of thered-emitting subpixels in FIG. 13 where the top electrode layer 118 isformed over both the red-emitting micro LED device 400, and the bondinglayer 140, where the bonding layer 140 is covered with the passivationlayer 148.

The embodiment illustrated in FIG. 11 is also illustrated as one of thered-emitting subpixels in FIG. 13 in which a replacement red-emittingmicro LED device 400 is bonded to the previously open repair bondingsite 401. As previously described, the open repair bonding site 401 mayhave been a bare surface on the bottom electrode layer 142, oralternatively may have included a bonding layer 140. Similar to FIG. 9,the top electrode layer 118 is formed over both the red-emitting microLED devices 400, and the defective or contaminated micro LED device400X, where the defective or contaminated micro LED device 400X iscovered with the passivation layer 148.

The embodiment illustrated in FIG. 12 is also illustrated as one of theblue-emitting subpixels in FIG. 13 in which a replacement blue-emittingmicro LED device 400 is bonded to the previously open repair bondingsite 401. Similar to FIG. 10, the top electrode layer 118 is formed overboth the blue-emitting micro LED devices 400, and the bonding layer 140,where the bonding layer 140 is covered with the passivation layer 148.

FIG. 14 is a top schematic view illustration of an array of micro LEDdevices including a variety of configurations described in FIGS. 9-12 inaccordance with embodiments of the invention. In the particularembodiments illustrated in FIG. 13, the arrangements of micro LEDdevices 400 are the same as those described above with regard to FIG.13. The embodiments illustrated in FIG. 14 differ from those illustratedin FIG. 13 particularly in formation of a plurality of separate topelectrode layers 118. In one embodiment, such as those illustrated inthe labeled pixel 106 where a micro LED device 400 is not placed on therepair bonding site 401, it is not required for the top electrode layers118 to be formed thereon. Accordingly, the length of the top electrodelayer 118 can be determined based upon whether or not a replacementmicro LED device is added. In addition, the blue-emitting subpixel inthe labeled pixel 106 shows a defective or contaminated micro LED device400X on the bonding site further away from the ground tie line. In suchan embodiment, the top electrode layer 118 may be formed over only theblue-emitting micro LED device 400, or over both the blue-emitting microLED device 400 and the defective or contaminated micro LED device 400X.The top electrode layer 118 may also be formed over the bonding site401.

FIG. 15 is a top schematic view illustration of an array of micro LEDdevices including a variety of configurations described in FIGS. 9-12 inaccordance with embodiments of the invention. In the particularembodiments illustrated in FIG. 15, the arrangements of micro LEDdevices 400 are the same as those described above with regard to FIGS.13-14. The embodiments illustrated in FIG. 15 differ from thoseillustrated in FIG. 14 particularly in formation of the plurality ofseparate top electrode layers 118. The embodiments illustrated in FIG.14 were shown as altering the length of the top electrode layers 118,while the embodiments illustrated in FIG. 15 are shown as altering thepath of the top electrode layers 118, and/or number of top electrodelayers 118. For example, in many of the embodiments illustrated in FIG.15, a separate top electrode layer 118 can be formed for every micro LEDdevice 400. In the embodiment illustrated in the bottom-mostblue-emitting subpixel, a single top electrode layer 118 can be formedfor multiple micro LED devices 400 where the path is adjusted to avoid abonding layer 140, or alternatively a defective or contaminated microLED device. In this manner, adjusting the path of the top electrodelayers 118 can be used in the alternative to, or in addition to,adjusting deposition of the passivation layer 148 to cover defective orcontaminated micro LED devices or the bonding sites of missing micro LEDdevices.

The formation of separate top electrode layer(s) 118 may provide anadditional benefit during electrical testing of the panel 100 afterformation of the top electrode layer(s) 118. For example, prior toformation of the top electrode layer 118 it may not have been possibleto detect certain defects resulting in shorting of a micro LED device400S. The implication of a shorted micro LED device 400S could result ina dark subpixel in which all of the current flows through the shortedmicro LED devices 400S rather than any of the other micro LED devices inthe subpixel. In the embodiment illustrated in FIG. 16 the top electrodelayer 118 connected to a shorted micro LED device 400S is cut using asuitable technique such as laser scribing. In this manner, electricalshorts that could not have been or were not detected during theintegrated testing method previously described could potentially bedetected during an electrical test with the application of electricalcurrent through the display after formation of the top electrode layer118. In such an embodiment, if a micro LED device 400S is shorted, thetop electrode layer 118 to the micro LED device 400S can be cut,allowing the redundant and/or repair micro LED device to provide theemission from the subpixel.

FIG. 17 illustrates an alternative embodiment where rather that cuttingor scribing the top electrode layer 118, the bottom electrode layer 124can be cut using a suitable technique such as laser scribing tosegregate irregular micro LED devices. In the particular embodimentillustrated, the bottom electrode layer 124 includes separate landingareas for the micro LED devices. In the particular embodimentillustrated, the bottom electrode 124 landing area supporting the microLED device 400S is cut using a suitable technique such as laser scribingto segregate the irregular micro LED device so that it is not inelectrical communication with the underlying TFT circuitry throughfilled opening 131.

FIG. 18 illustrates a display system 1800 in accordance with anembodiment. The display system houses a processor 1810, data receiver1820, a display panel 100, 200, such as any of the display panelsdescribed above. The data receiver 1820 may be configured to receivedata wirelessly or wired. Wireless may be implemented in any of a numberof wireless standards or protocols including, but not limited to, Wi-Fi(IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, long termevolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA,TDMA, DECT, Bluetooth, derivatives thereof, as well as any otherwireless protocols that are designated as 3G, 4G, 5G, and beyond.

Depending on its applications, the display system 1800 may include othercomponents. These other components include, but are not limited to,memory, a touch-screen controller, and a battery. In variousimplementations, the display system 1800 may be a television, tablet,phone, laptop, computer monitor, kiosk, digital camera, handheld gameconsole, media display, ebook display, or large area signage display.

In utilizing the various aspects of this invention, it would becomeapparent to one skilled in the art that combinations or variations ofthe above embodiments are possible for integrating a redundancy schemeand repair site into an active matrix display panel, as well asintegrating a testing method for detecting irregularities in the arrayof micro LED devices such as missing, defective, or contaminated microLED devices.

While the above embodiments have been described with regard to activematrix display panels, the redundancy scheme, repair site, and testingmethod for detecting missing, defective, or contaminated micro LEDdevice can also be implemented into passive matrix display panels, aswell as substrates for lighting purposes. In addition, while the aboveembodiments have been described with regard to a top emission structure,embodiments of the invention are also applicable to bottom emissionstructures. Similarly, while top gate transistor structures have beendescribed, embodiments of the invention may also be practiced withbottom gate transistor structures. Furthermore, while embodiments of theinvention have been described and illustrated with regard to a high sidedrive configuration, embodiments may also be practiced with a low sidedrive configuration in which the ground tie lines and ground ringdescribed above become the power line in the panel. Although the presentinvention has been described in language specific to structural featuresand/or methodological acts, it is to be understood that the inventiondefined in the appended claims is not necessarily limited to thespecific features or acts described. The specific features and actsdisclosed are instead to be understood as particularly gracefulimplementations of the claimed invention useful for illustrating thepresent invention.

What is claimed is:
 1. (canceled)
 2. A display panel redundancy schemecomprising: an array of micro controller chips; an array of micro lightemitting diode (LED) pairs connected with the array of micro controllerchips in an array of pixel areas; wherein each pixel area includes amicro controller chip connected to a corresponding group of micro LEDpairs arranged in a plurality of subpixels; and wherein the group ofmicro LED pairs includes a group of primary micro LEDs arranged in theplurality of subpixels, and a group of redundant micro LEDs arranged inthe plurality of subpixels such that each subpixel includes a micro LEDpair.
 3. The display panel of claim 2, wherein each pixel area includesa first subpixel, a second subpixel, and a third subpixel.
 4. Thedisplay panel of claim 3, wherein: each first subpixel includes a firstprimary micro LED and a first redundant micro LED to emit a firstprimary color emission; each second subpixel includes a second primarymicro LED and a second redundant micro LED to emit a second primarycolor emission; each third subpixel includes a third primary micro LEDand a third redundant micro LED to emit a third primary color emission;and wherein the first, second and third primary color emissions aredifferent from one another.
 5. The display panel of claim 2, whereineach primary micro LED and each redundant micro LED is a separate devicethat has a maximum width of 1 to 100 μm.
 6. The display panel of claim5, wherein each primary micro LED and each redundant micro LED comprisesa p-n diode, a top conductive contact, and a bottom conductive contactthat is bonded to a display substrate.
 7. The display panel of claim 2,wherein each primary micro LED and each redundant micro LED is aseparate device that has a maximum width of 1 to 30 μm.
 8. The displaypanel of claim 2, wherein each primary micro LED and each redundantmicro LED is a separate device that has a maximum width of 1 to 10 μm.9. The display panel of claim 2, wherein the array of pixel areas has apixel density of at least 40 pixels per inch.
 10. The display panel ofclaim 2, wherein the array of pixel areas has a pixel density of atleast 299 pixels per inch.
 11. The display panel of claim 2, whereineach pixel area is a passive matrix.
 12. The display panel of claim 11,further comprising a plurality of top electrode layers in electricalcontact with the array of micro LED pairs.
 13. The display panel ofclaim 12, wherein the array of micro LED device pairs is on a displaysubstrate.
 14. The display panel of claim 13, further comprising aplurality of Vss tie lines within a display substrate.
 15. The displaypanel of claim 14, further comprising a planarization layer formed overthe plurality of Vss tie lines.
 16. The display panel of claim 14,wherein the plurality of top electrode layers is in electricalconnection with the plurality of Vss tie lines.
 17. The display panel ofclaim 14, further comprising a passivation layer material coveringsidewalls of the array of redundant micro LED pairs, and the pluralityof top electrode layers span over a top surface of the passivation layermaterial.
 18. The display panel of claim 14, further comprising aplurality of power supply lines coupled to the plurality of microcontroller chips.
 19. The display panel of claim 14, wherein theplurality of top electrode layers is formed of a material selected fromthe group consisting of a transparent conductive oxide and a transparentconducting polymer.
 20. The display panel of claim 14, wherein eachprimary micro LED and each redundant micro LED is a separate device thathas a maximum width of 1 to 10 μm.
 21. The display panel of claim 20,wherein the array of pixel areas has a pixel density of at least 299pixels per inch.